PS5 SLIM Overheating

Liquid Metal Thermal Compound (Gallium-based)

The PS5 Slim utilizes liquid metal as the primary thermal interface. Over time, or due to manufacturing variance, the metal can oxidize or pool at the bottom of the APU shroud, creating 'dry spots' on the silicon. This results in inefficient heat transfer to the heatsink, triggering the 'PS5 is too hot' warning regardless of fan speed.

SKU: N/A (Thermal Grizzly Conductonaut recommended)

Internal Heatsink Assembly

In the Slim revision, certain heat pipe elements are adhered using a thermal adhesive/glue rather than traditional soldering. If this bond fails due to heat stress or vibration, the heat pipe loses physical contact with the copper baseplate. This creates a thermal bottleneck where the heat cannot reach the dissipation fins, rendering the cooling system ineffective even if clean.

Replacement Internal Cooling Fan

The Slim's compact chassis relies on a specific high-static-pressure fan curve. Mechanical failure of the fan bearings or accumulation of dust within the motor housing can lead to reduced RPM or failure to reach the high-speed 'boost' state required during graphically intensive games, leading to rapid heat buildup.

SKU: G12L12MS1AH-56J14