XBOX SERIES S Overheating

High-Performance Thermal Interface Material

The factory-applied thermal paste undergoes 'pump-out' and desiccation over time, creating microscopic air gaps between the APU and the heatsink. This increases the junction-to-case thermal resistance, causing the SoC to hit thermal trip points even if the fan is at maximum RPM. Replacing the TIM restores the conductive heat path necessary for stable operation.

Internal Cooling Fan Assembly

The axial fan is the sole moving component responsible for active heat dissipation; bearing wear or dust ingress into the motor hub can result in reduced RPM or complete seizure. If the fan cannot maintain the required CFM (cubic feet per minute) to exhaust heat from the dense internal heatsink, the system will execute a hard shutdown to prevent permanent silicon damage.

SKU: M1108151-001

Electronic Grade Compressed Air / Cleaning Kit

Particulate matter accumulates within the high-density aluminum heatsink fins, creating an insulating layer that prevents efficient convective heat transfer. Using a high-pressure duster is the primary mechanical method to clear these blockages and restore the original airflow design parameters, which is the most common fix for 'overheating' warnings.