HP OMEN 15 Overheating And Shutting Down

High-Performance Thermal Interface Material (TIM)

Over time, factory thermal paste dries and undergoes 'pump-out' due to repeated thermal expansion cycles, creating air gaps between the processor and the heatsink. Replacing this with high-viscosity TIM restores the conduction path, allowing heat to move efficiently into the cooling fins rather than saturating the silicon die.

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Internal CPU/GPU Cooling Fan Assembly

The dual-fan system in the Omen 15 can suffer from sleeve bearing wear or dust-induced friction, preventing the fans from reaching the high RPMs required for gaming loads. If the fans cannot maintain the necessary CFM (cubic feet per minute), the heat pipes reach a state of thermal saturation, leading to an emergency system power-off to protect the motherboard.

SKU: L29354-001

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Thermal Pad Replacement Kit

Secondary components like Voltage Regulator Modules (VRMs) and VRAM chips require high-quality thermal pads to bridge the gap to the heatsink assembly. If these pads degrade or lose contact, the specific localized heat can trigger a sensor-based shutdown even if the CPU temperature appears relatively stable.

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