DELL ALIENWARE M15 Overheating Instantly

High-Performance Thermal Interface Material

The 'pump-out' effect occurs when the thermal expansion of the CPU die physically pushes the paste out of the contact zone over time. This creates an insulating air gap that prevents conductive heat transfer to the heatsink, resulting in immediate temperature spikes. Application of a high-viscosity, non-conductive compound restores the microscopic bridge between the silicon and the copper cold plate.

CPU/GPU Heatsink and Vapor Chamber Assembly

If the hermetic seal of the copper heat pipes is compromised, the internal vacuum is lost and the working fluid (typically water or ethanol) cannot undergo the phase change required for rapid heat transport. In this state, the copper pipes act as slow thermal conductors rather than high-speed heat transporters, causing the CPU to reach T-junction limits within seconds of load. Replacing the entire assembly ensures the integrity of the vapor-phase cooling system.

SKU: 0N96YV

OEM Replacement Cooling Fans

Mechanical failure of the fluid dynamic bearings can lead to insufficient RPMs or total seizure, eliminating forced convection. Without sufficient airflow to remove heat from the fin stacks, the thermal energy remains localized at the processor. New fans ensure the dissipation of energy from the radiator fins to the ambient environment at the intended CFM rating.