ASUS ROG ZEPHYRUS G14 Leak

Honeywell PTM7950 Phase Change Thermal Pad

This material transitions from a solid to a liquid state only when reaching 45°C and remains trapped within the die bounds via high molecular weight polymer chains. It solves the root cause of 'leaking' by providing high thermal conductivity without the fluid-state migration risks inherent to gallium alloys.

SKU: PTM7950-01

ASUS OEM Thermal Module Heatsink Assembly

If a leak has occurred, the gallium often reacts with the copper or nickel plating of the heatsink, causing 'pitting' or 'staining' that degrades thermal transfer. Replacing the entire assembly ensures a fresh 0.1mm chemical-resistant barrier and a perfectly flat mating surface for new TIM application.

Insulating Polyimide Tape / Kapton Tape

Used as a secondary containment measure to mask off surface-mount devices (SMDs) surrounding the CPU/GPU dies. This provides a dielectric shield that prevents leaked conductive material from creating a bridge between electrical contacts on the PCB.